Substrate Processing Apparatus and Rotating Electrical Connector for Vacuum

ABSTRACT

A substrate processing apparatus includes: a disk including a plurality of electrostatic chucks periodically disposed at a constant radius from a central axis; a disk support supporting the disk; a DC line electrically connected to the plurality of electrostatic chucks through the disk support; and a power supply configured to supply power to the DC line. The DC line includes: a first DC line penetrating through the disk support from the power supply; a power distribution unit configured to distribute the first DC line to connect the first DC line to each of the plurality of electrostatic chucks; and a plurality of second DC lines respectively connected to the plurality of electrostatic chucks in the power distribution unit.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of and claims priority toPCT/KR2018/006511 filed on Jun. 8, 2018, which claims priorities toKorea Patent Application No. 10-2017-0076715 filed on Jun. 16, 2017 andKorea Patent Application No. 10-2017-0076714 filed on Jun. 16, 2017, theentireties of which are both hereby incorporated by reference.

TECHNICAL FIELD

The present disclosure relates to substrate processing apparatuses, andmore particularly, to a substrate processing apparatus capable ofimproving uniformity through revolution of a main disk and rotation of asub-disk when a plurality of substrates are processed.

The present disclosure relates to a rotating electrical connector, andmore particularly, to a rotating electrical connector for vacuum.

BACKGROUND Substrate Processing Apparatus

In general, a semiconductor memory device, a liquid crystal display, anorganic light emitting device, and the like, are manufactured by amanufacturing process in which a semiconductor process is performedtwice or more times on a substrate to deposit and stack a structurehaving a desired shape.

A semiconductor manufacturing process includes a deposition process inwhich a predetermined thin film is deposited on a substrate, aphotolithography process in which a selected region of the thin film isexposed, an etching process in which the thin film of the selectedregion is removed, and the like. Such a semiconductor process isperformed in a process chamber in which an optimal environment isestablished for a corresponding process.

In general, an apparatus for processing a circular substrate such as awafer is disposed inside a process chamber, and has a structure in whicha plurality of second disks (sub-disks), each having a size smaller thana circular first disk (a main disk), are mounted on the first disk.

In a substrate processing apparatus, substrate process is performed byseating a substrate on the second disk, rotating the first disk androtating and revolving the second disk, and injecting a source materialonto the substrate to deposit and stack a structure having a desiredshape on the substrate.

At this point, an additional apparatus for injecting air or another gasis used to rotate the second disk about an axis thereof. In this case,foreign substances contained in the air or gas may be adsorbed to thesubstrate to cause product defects.

Korean Patent Publication No. 10-2016-0073281 discloses that a metaldisk is rotated when s magnet is relatively moved to only a neighboringportion of the metal disk based on Arago's principle. However, therotation of the metal disc based on the Arago's principle is difficultto control precise rotation speed and to precisely stop the metal diskin a desired location.

Accordingly, there is a need for a rotation method of stably rotatingthe second disk mounted on the first disk while revolving the firstdisk. In addition, there is a need for a fixing method of stably fixingthe substrate mounted on the second disk against centrifugal force.

[Rotating Electrical Connector]

A slipring is an electrical/mechanical component, also called a rotaryconnector, and is a type of rotation connector, capable of supplyingpower or a signal line to a rotating device without twisting of electricwires.

In general, an apparatus for processing a circular substrate such as awafer is disposed inside a process chamber, and has a structure in whicha plurality of second disks (sub-disks), each having a size smaller thana circular first disk (a main disk), are mounted on the first disk.

In a substrate processing apparatus, substrate process is performed byseating a substrate on the second disk, rotating the first disk androtating and revolving the second disk, and injecting a source materialonto the substrate to deposit and stack a structure having a desiredshape on the substrate.

At this point, an additional apparatus for injecting air or another gasis used to rotate the second disk about an axis thereof. In this case,foreign substances contained in the air or gas may be adsorbed to thesubstrate to cause product defects.

When mounting an electrostatic chuck rotating while revolving in asubstrate processing apparatus, there is demand for a method of stablytransmitting a high voltage in a vacuum state to the electrostaticchuck. In the case in which the electrostatic chuck is a bipolarelectrostatic chuck, a conventional slipring cannot be used becauseparasitic discharge occurs.

SUMMARY

An aspect of the present disclosure is to provide a substrate processingapparatus, capable of stably providing a high DC voltage to a pluralityof rotating electrostatic chuck.

An aspect of the present disclosure is to provide a substrate processingapparatus providing a rotation ratio, having an appropriate revolutionperiod and an appropriate rotation period, to a plurality of rotatingelectrostatic chucks.

An aspect of the present disclosure is to provide a rotating electricalconnector performing electrical connection between a rotational motionand a high voltage without parasitic discharge in a vacuum chamber.

According to an aspect of the present disclosure, a substrate processingapparatus includes: a disk including a plurality of electrostatic chucksperiodically disposed at a constant radius from a central axis; a disksupport supporting the disk; a DC line electrically connected to theplurality of electrostatic chucks through the disk support; and a powersupply configured to supply power to the DC line. The DC line includes:a first DC line penetrating through the disk support from the powersupply; a power distribution unit configured to distribute the first DCline to connect the first DC line to each of the plurality ofelectrostatic chucks; and a plurality of second DC lines respectivelyconnected to the plurality of electrostatic chucks in the powerdistribution unit.

In an example embodiment, the power distribution unit may include: aninternal power distribution ring having a plurality of first connectionterminals protruding in an external radial direction and charged with apositive voltage and disposed on an upper surface of the disk; and anexternal power distribution ring having a second connection terminalprotruding in an internal radial direction and charged with a negativevoltage and disposed on an upper surface of the disk.

In an example embodiment, the internal power distribution ring may havea snap ring shape in which a portion of a radius is cut, the externalpower distribution ring may have a snap ring shape in which a portion ofa radius is cut, and the cut portion of the internal power distributionring and the external power distribution ring may be disposed to opposeeach other. The first DC line may include a first positive DC line and afirst negative DC line. The internal power distribution ring may includea first connection portion connecting one end of the first positive DCline and an opposite side of the cut portion of the internal powerdistribution ring. The external power distribution ring may include asecond connection portion connecting one end of the first negative DCline and an opposite side of the cut portion of the external powerdistribution ring.

A rotating electrical connector for vacuum according to an exampleembodiment may include a rotator formed of an insulating material andhaving a cylindrical shape; an upper conductive ring and a lowerconductive ring disposed to cover side surfaces of the rotator andspaced apart from each other, and an intermediate insulating barrierdisposed between the upper conductive ring and the lower conductivering. The intermediate insulating barrier may block generation of plasmabetween the upper conductive ring and the lower conductive ring.

In an example embodiment, the rotating electrical connector for vacuummay further include an upper insulating barrier, disposed above theupper conductive ring, and the lower insulating barrier disposed belowthe lower conductive ring. The intermediate insulating barrier mayprotrude further in an external radius direction than the upperinsulating barrier and the lower insulating barrier.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure will become more apparent in view of the attacheddrawings and accompanying detailed description. The embodiments depictedtherein are provided by way of example, not by way of limitation,wherein like reference numerals refer to the same or similar elements.The drawings are not necessarily to scale, emphasis instead being placedupon illustrating aspects of the present disclosure.

FIG. 1 is a plan view illustrating a magnetic gear of a substrateprocessing apparatus according to an example embodiment of the presentdisclosure.

FIG. 2 is a plan view illustrating a power distribution unit of thesubstrate processing apparatus in FIG. 1.

FIG. 3 is an enlarged plan view of the power distribution unit of thesubstrate processing apparatus in FIG. 2.

FIG. 4 is a cross-sectional view taken along line A-A′ in FIG. 2.

FIG. 5 is a cross-sectional view taken along line B-B′ in FIG. 2.

FIG. 6 is a cross-sectional view of an electrostatic chuck according toan example embodiment of the present disclosure.

FIG. 7 is a perspective view of a rotating electrical connector forvacuum with a cover removed, according to an example embodiment of thepresent disclosure.

FIG. 8 is a cross-sectional view taken along line I-I′ in FIG. 7.

FIG. 9 is a cross-sectional view taken along line B-B′ in FIG. 7.

FIG. 10 is a perspective view of an input connector insulating block ofthe rotating electrical connector in FIG. 7.

FIG. 11 is a perspective view of a brush in FIG. 7.

FIG. 12 is a perspective view of a brush support part according toanother example embodiment of the present disclosure.

FIG. 13 is a cross-sectional view illustrating a rotating electricalconnector for vacuum provided with the brush support part in FIG. 12.

FIG. 14 is a plan view illustrating a magnetic gear of a substrateprocessing apparatus according to an example embodiment of the presentdisclosure.

FIG. 15 is a cross-sectional view illustrating the substrate processingapparatus in FIG. 14.

FIG. 16 is an enlarged view illustrating an electrostatic chuck and arotating electrical connector in FIG. 14.

DETAILED DESCRIPTION

[Substrate Processing Apparatus]

In order to simultaneously process substrates respectively disposed in aplurality of electrostatic chucks rotating in a single chamber, thesubstrates are required to simultaneously revolve and rotate and to bestably fixed against centrifugal force generated by the revolution androtational motions.

A mechanical chuck may stably fix a substrate, but the mechanical chuckis difficult to be disposed on a rotating plate (or a second disk)revolving and rotating at the same time in a revolving plate (or a firstdisk) revolving.

On the other hand, although the electrostatic chuck can stably fix thesubstrate, it is difficult to perform electrical wiring on a revolvingplate (or the first disk) and a rotating plate (or the second disk)which simultaneously revolves and rotates.

According to an example embodiment, a magnetic gear may provide arotational motion while revolving on the second disk, and anelectrostatic chuck is also used to fix the substrate. Electrical wiringis performed between the electrostatic chuck and the rotating first diskusing a rotating connector structure. Accordingly, a substrate may bestably fixed and may rotate while revolving, and thus, processuniformity may be ensured. A power distribution unit, disposed on thefirst disk, may distribute a high DC voltage to a plurality of rotatingconnector structures. The power distribution unit includes an internalpower distribution ring and an external distribution ring disposed on anupper surface of the first disk, and includes a first lower extendingportion and a second lower extending portion radially extending from alower surface of the first disk. In addition, the power distributionunit is coated with an insulating material to have improved insulationproperty and to be readily decoupled/coupled.

According to an example embodiment, a structure in which rotating plates(second disks or electrostatic chucks) are disposed on a revolving plate(a first disk) is provided, and the rotating plate rotates whilerevolving according to the revolution of the revolving plate.Accordingly, to rotate the rotating plate, a magnetic gear includesfirst magnetic gears, second magnetic gears, and third magnetic gears.The first magnetic gear rotates with the rotating plate, and the secondmagnetic gear is fixed without rotation in a center of a chamber. Inorder to adjust a rotation ratio of the second magnetic gear and thefirst magnetic gear, the third magnetic gear is disposed between each ofthe first magnetic gears and the first magnetic gear and is disposed tobe rotationally fixed the first disk. The second magnetic gear is fixedin the center of the chamber without rotating, and the first magneticgear is coupled to the rotating plate to rotate with the rotating plate.

According to an example embodiment, when a height of the first disk ischanged to change a placement plane of the substrate, heights of thefirst magnetic gear and the third magnetic gear are changed.Accordingly, in order to operate the magnetic gear, a placement plane ofthe second magnetic gear may be adjusted to be the same as a placementplane of each of the first magnetic gear and the third magnetic gear.

In order to use an electrostatic chuck, the second disk and the firstdisk are required to be electrically connected. To this end, therevolving plate (the first disk) and the rotating plate (the seconddisk) are wired using a first rotating connector structure (or aslipring), and the revolving plate (the first disk) is connected toexternal power through a second rotating connector structure.

The first disk may include a power distribution unit for electricalwiring in the electrostatic chucks. The power distribution unit may havea ring shape and may be disposed on an upper surface of the first diskto provide efficient wiring.

Additionally, a placement plane of the substrate may be changed tochange process conditions. In this case, the placement plane of therevolving plate (the first disk) may be changed using a bellowsstructure.

Hereinafter, embodiments will be described in detail with reference tothe accompanying drawings. While the disclosure is subject to variousmodifications and alternative forms, specific embodiments thereof areshown by way of example in the drawings and are explained in detail inthe description. However, the disclosure should not be construed asbeing limited to the embodiments set forth herein, but on the contrary,the disclosure is intended to cover all modifications, equivalents, andalternatives falling within the spirit and scope of the embodiments. Inthe drawings, the sizes or shapes of elements may be exaggerated forconvenience and clarity of description.

It may be understood that, although the terms “first,” “second,” etc.may be used herein to describe various elements, these elements are notto be construed as being limited by these terms. These terms aregenerally only used to distinguish one element from another. Inaddition, terms particularly defined in consideration of theconstruction and operation of the embodiments are used only to describethe embodiments, but do not define the scope of the embodiments.

It will be understood that when an element is referred to as being “on”or “under” another element, it can be directly on/under the element, orone or more intervening elements may also be present. When an element isreferred to as being “on” or “under,” “under the element” as well as “onthe element” can be included based on the element.

In addition, relational terms, such as “on/upper part/above” and“under/lower part/below,” are used only to distinguish between onesubject or element and another subject or element, without necessarilyrequiring or involving any physical or logical relationship or sequencebetween the subjects or elements.

FIG. 1 is a plan view illustrating a magnetic gear of a substrateprocessing apparatus according to an example embodiment of the presentdisclosure.

FIG. 2 is a plan view illustrating a power distribution unit of thesubstrate processing apparatus in FIG. 1.

FIG. 3 is an enlarged plan view of the power distribution unit of thesubstrate processing apparatus in FIG. 2.

FIG. 4 is a cross-sectional view taken along line A-A′ in FIG. 2.

FIG. 5 is a cross-sectional view taken along line B-B′ in FIG. 2.

FIG. 6 is a cross-sectional view of an electrostatic chuck according toan example embodiment of the present disclosure.

Referring to FIGS. 1 to 6, a substrate processing apparatus 100according to an example embodiment includes a disk 124 including aplurality of electrostatic chucks 170 periodically disposed at aconstant radius from a central axis, a disk support 122 supporting thedisk 124, a DC line 200 electrically connected to the plurality ofelectrostatic chucks 170 through the disk support 122, and a powersupply 114 configured to supply power to the DC line 200. The DC line200 may include a first DC line 240 penetrating through the disk support122 from the power supply 114, a power distribution unit 250 configuredto distribute the first DC line 240 to connect the first DC line 240 toeach of the plurality of electrostatic chucks 170, and a plurality ofsecond DC lines 260 respectively connected to the plurality ofelectrostatic chucks 170 in the power distribution unit 250.

The chamber 102 may be a cylindrical chamber. The chamber 102 mayperform a thin film deposition process or a substrate surface treatmentprocess. A gas distribution unit 180 may be disposed on an internalupper surface of the chamber 102. The gas distribution unit 180 may havea toroidal shape having a rectangular section. A lower surface of thegas distribution unit 180 may include a plurality of gas injection holesthrough which a gas may be injected to the substrate 10 to perform adeposition process. The electrostatic chucks 170 may be periodicallydisposed on the lower surface of the gas distribution unit 180 at aconstant radius.

The disk 124 may be a circular plate. The disk 124 may rotate about acentral axis thereof. The disk 124 may include a plurality of seatingholes 124 a disposed on a circumference having a constant radius atregular intervals. The number of the seating holes 124 a may be six. Apower distribution unit 250 may be disposed on an upper surface of thedisk 124.

The rotating plate 162 may be inserted into the seating hole 124 a orthe first rotating connector structure 150. The rotating plate 162 mayrevolve with the rotation of the disk 124. The rotating plate 162 mayrotate while revolving through magnetic gears 140, 130, and 230. Angularspeed of the rotation may be determined by a gear ratio of the magneticgear. The rotating plate 162 may be in the form of a disk, and may beformed of a material such as a metal, graphite, quartz, or the like. Therotating plate 162 may support the electrostatic chuck 170 and may becoupled to the first magnetic gear 140.

The first rotating connector structure 150 may be disposed to cover therotating plate 162 and may be inserted into the seating hole 124 a. Thefirst rotating connector structure 150 has an upper bearing and a lowerbearing vertically spaced apart from each other, a slipring bodydisposed between the upper bearing and the lower bearing, and at leastone slipring disposed on an external circumferential surface of theslipring body, and a brush electrically connected to the slipring. Thefirst rotating connector structure 150 will be described in detail lateras a rotating electrical connector for vacuum.

An upper surface of the upper bearing may be substantially the same asan upper surface of the disk 124, and a lower surface of the lowerbearing may be substantially the same as a lower surface of the rotatingplate 162. Each of the upper bearing and the lower bearing may have atoroidal shape. The slipring body may have a toroidal shape, may bedisposed between the upper bearing and the lower bearing, and may berotatable and electrically insulated or formed of an insulatingmaterial. The slipring may be disposed to be exposed to an externalcircumferential surface of the slipring body to be electricallyconnected to the brush. The brush may be in electrical contact with therotating slipring 151 using elasticity to provide an electricalconnection.

The electrostatic chuck 170 may be disposed on an upper surface of therotating plate 162. The electrostatic chuck 170 may receive power from alead line extending through a lead line path formed in the rotatingplate 162. The electrostatic chuck 170 may have a lead line path, andthe conductive wire passing through the lead line path may performelectrical connection with an electrostatic electrode.

The electrostatic chuck 170 may include an electrostatic chuck body 171,an electrode seating portion 171 a recessed in an upper surface of theelectrostatic chuck body 171, an insulating member 174 filling theelectrode seating portion 171 a, and a pair of electrostatic electrodes172 embedded in the insulating member 174. The electrostatic chuck 170may operate as a bipolar electrostatic chuck. A lower surface of theelectrostatic chuck 170 may be higher than an upper surface of the disk124. The electrode seating portion 171 a may have a disk shape, and anupper surface of the electrode body 171 and an upper surface of theinsulating member 174 may be substantially the same. The insulatingmember 174 may be disposed to cover the pair of electrostatic electrodes172. A thickness of a lower insulating member 174 b, disposed on thelower surface of the electrostatic electrode 172, may be greater than athickness of an upper insulating member 174 a disposed on the uppersurface of the electrostatic electrode 172. The lower insulating member174 b may be formed on the electrostatic chuck body 171 through thermalspray coating, and may be coated by printing the electrostaticelectrode. After the electrostatic electrode is patterned, the upperinsulating member may be formed through thermal spray coating. Theinsulating member 174 may supply Coulomb-type electrostatic force orJohnsen-Rahbek type electrostatic force depending on resistivity. Eachof the pair of electrostatic electrodes 172 a and 172 b may have awasher shape of concentric structure. The second electrostatic electrode172 b may cover the first electrostatic electrode 172 a with theconcentric structure, and the pair of electrostatic electrodes 172 a and172 b may be disposed on the same plane.

The electrostatic electrode 172 may include a first electrostaticelectrode 172 a and a second electrostatic electrode 172 b having aconcentric structure, and a high DC voltage may be applied between thefirst electrostatic electrode 172 a and the second electrostaticelectrode 172 b. Accordingly, the substrate disposed on theelectrostatic chuck 172 may be fixed by electrostatic suction force.

The disk support 122 may extend from a central axis of the disk in adirection of a lower surface of the chamber 102. The disk support 122may have a cylindrical shape, and the disk support 122 may have a leadline path in which a lead line may be disposed. The first DC line 240may be disposed in the conductive path. The disk support 122 may befixedly coupled to the disk 124.

The second rotating connector structure 112 may be axially coupled toone end of the disk support 122 penetrating through the bellowsstructure 116 and may provide an electrical connection while providing arotational motion. The second rotating connector structure 112 mayperform substantially the same function as the first rotating connectorstructure 150. The second rotating connector structure 112 may be aslipring. A brush may be connected to the power supply 114, and maysupply power to the first DC line 240 disposed in the lead line pathextending along the disk support 122 operating through the secondrotating connector structure. The power may be supplied to theelectrostatic chuck 170 through the DC line 200 and the first rotatingconnector structure 150. The power supply 114 may output a positive DCvoltage and a negative DC voltage.

A rotation driving unit 110 may be coupled to one end of the disksupport 112 to rotate the disk support 122. The rotation driving unit110 may be a motor. According to elasticity of the bellows structure116, the rotation driving unit 110, the second rotating connectorstructure 112, the disk support 122, and the disk 124 may verticallymove.

First magnetic gears 140 may be respectively fixed to lower surfaces ofthe rotating plates 162 to provide rotational force to the rotatingplate 162 and the electrostatic chuck 170. The second magnetic gear 130may be disposed below the disk 124 to be fixed to the chamber 102. Thirdmagnetic gears 230 may be rotatably fixed to the lower surface of thedisk and may be respectively disposed between the first magnetic gears140 and the second magnetic gear 130 to adjust a rotation ratio. As thedisk 124 revolves, the first magnetic gears 140 and the third magneticgears 230 may rotate.

Each of the electrostatic chuck 170 and the rotating plate 162 may haveat least three vertical through-holes. The vertical through-holes may bevertically aligned with each other in the electrostatic chuck 170 andthe rotating plate 162. When the disk and the rotating plate arestopped, a lift pin 194 lifting the substrate may be inserted throughthe vertical through-hole. The lift pin 194 may be vertically andlinearly moved by a lift pin driving unit 192.

The DC line includes a first DC line 240 penetrating through the disksupport 122 at the power supply 114, a power distribution unit 250configured to distribute the first DC line 240 to connect the first DCline 240 to each of the plurality of electrostatic chucks 170, and aplurality of second DC lines 260 connected to each of the plurality ofelectrostatic chucks 170 at the power distribution unit 250. The DC line200 may be coated with an insulating material. A component, constitutingthe DC line 200, may be aluminum and may be anodized to coated with aninsulating material.

The power distribution unit may include an internal power distributionring, having a plurality of first connection terminals protruding in anexternal radial direction and charged with a positive voltage anddisposed on an upper surface of the disk, and an external powerdistribution ring having a second connection terminal protruding in aninternal radial direction and charged with a negative voltage anddisposed on an upper surface of the disk.

The internal power distribution ring may have a snap ring shape in whicha portion of a radius is cut, and the external power distribution ringhas a snap ring shape in which a portion of a radius is cut. The cutportion of the internal power distribution ring and the external powerdistribution ring may be disposed to oppose each other.

The first DC line may include a first positive DC line and a firstnegative DC line. The internal power distribution ring may include afirst connection portion connecting one end of the first positive DCline and an opposite side of the cut portion of the internal powerdistribution ring. The external power distribution ring may include asecond connection portion connecting one end of the first negative DCline and an opposite side of the cut portion of the external powerdistribution ring.

The power distribution unit may further include: a first contact plugconnected to the first connection terminal and extending through thedisk; and a second contact plug connected to the second connectionterminal and extending through the disk.

The second DC line may include a second positive DC line and a secondnegative DC line. One end of the second positive DC line may beconnected to the first contact plug, and the second positive DC line mayextend from a lower surface of the disk. One end of the second negativeDC line may be connected to the second contact plug, and the secondnegative DC line may extend from the lower surface of the disk. Each ofthe second positive DC line and the second negative DC line may be bentto have a “V” shape.

The second positive DC line and the second negative DC line may beconnected to the first rotating connector structure. The first contactplug and the second contact plug may be disposed to form a pair on aconstant radius.

A first positive DC line 240 a and a first negative DC line 240 b may bedisposed side by side through the disk 124 and the disk support 122. Thefirst positive DC line 240 a may be connected to a positive DC voltage,and the first negative DC line 240 b may be connected to a negative DCvoltage. Each of the first positive DC line 240 a and the first negativeDC line 240 b may be formed of aluminum and may have a cylindricalshape. The first positive DC line 240 a and the first negative DC line240 b may be coated with an insulating material to be insulated.

An internal power distribution ring 252 may be electrically connected tothe first positive DC line 240 a and may be disposed on an upper surfaceof the disk 124. The internal power distribution ring 252 may be coatedwith an insulating material to be insulated. The internal powerdistribution ring 252 may have a snap ring shape in which a portion of aradius is cut. The internal power distribution ring 252 may include afirst connection portion 252 b connecting one end of the first positiveDC line 240 a to an opposite side of the cut portion of the internalpower distribution ring. A central axis of the internal powerdistribution ring may be substantially aligned with the first positiveDC line.

The internal power distribution ring 252 may be in the form of a striphaving a predetermined thickness. The internal power distribution ring252 may be coated with an insulating material to be insulated. Theinternal power distribution ring 252 may include a plurality of firstconnection terminals 252 a disposed on a circumference at regularintervals to protrude outwardly.

An external power distribution ring 254 may be electrically connected tothe first negative DC line 240 b and may be disposed on the uppersurface of the disk 124. The external power distribution ring 254 may bedisposed to cover the internal power distribution ring 252 and may havethe same central axis. The external power distribution ring 254 may havea snap ring shape in which a portion of a radius is cut. The cut portionof the internal power distribution ring and the cut portion of theexternal power distribution ring may be disposed to oppose each other.The external power distribution ring 254 may include a second connectionportion 254 b connecting one end of the first negative DC line to anopposite side of the cut portion of the external power distributionring. The external power distribution ring 254 may be in the form of astrip having a predetermined thickness. The external power distributionring may be coated with an insulating material to be insulated. Theexternal power distribution ring 254 may include a plurality of secondconnection terminals 254 a disposed on the circumference at regularintervals to protrude inwardly.

The first contact plug 253 may be electrically connected to the firstconnection terminal 252 a and may extend to the lower surface of thedisk 124 through the disk 124. The first contact plug 253 may be formedof a conductive material, and an external circumferential surfacethereof may be coated with an insulating material to be insulated.

The second contact plug 255 may be electrically connected to the secondconnection terminal 254 a and may extend to the lower surface of thedisk 124 through the disk 124. The second contact plug 255 may be formedof a conductive material, and an external circumferential surfacethereof may be coated with an insulating material to be insulated. Thefirst contact plug and the second contact plug may be disposed adjacentto each other to form a pair. The first contact plugs and the secondcontact plugs may be alternately disposed on a constant radius.

The second DC line 260 may include a second positive DC line 260 a and asecond negative DC line 260 b. The second positive DC line 260 a mayextend from the lower surface of the disk and may be electricallyconnected to the first contact plug 253. The second negative DC line 260b may extend from the lower surface of the disk and may be electricallyconnected to the second contact plug 255. Each of the second positive DCline 260 a and the second negative DC line 260 b may be bent to have a“V” shape. The second positive DC line 260 a and the second negative DCline 260 b extend parallel to each other and are connected to the brushof the first rotating connector structure 150. Accordingly, theelectrostatic chuck may be supplied with a positive voltage and anegative voltage.

An upper cover 259 may be disposed on the disk and may be disposed tocover the internal power distribution ring 252 and the external powerdistribution ring 254. The upper cover 259 may have a disk shape and maybe a cut portion 259 a recessed in a location, where the electrostaticchucks are disposed, to have a semicircular shape. The upper cover 259may be formed of a dielectric material. A washer-shaped recessedportion, not illustrated, may be disposed on a lower surface of theupper cover, and the internal power distribution ring 252 and theexternal power distribution ring 254 may be disposed on the recessedportion. The recessed portion may be continuously connected to a pair oftrenches extending to face each other in a central direction thereof.The pair of trenches may be disposed to cover the first connectionportion 252 b and the second connection portion 254 b.

[Rotating Electrical Connector]

A rotating electrical connector according to an example embodiment mayprovide an electrical connection to an electrostatic chuck whilerotating the electrostatic chuck. When the rotating electrical connectoris disposed inside a vacuum chamber, it may include brushes disposed tooppose each other to suppress parasitic DC plasma discharge. Therotating electrical connector may be a slipring and may suppressparasitic discharge between a positive electrode ring and a negativeelectrode ring.

According to an example embodiment, even when a positive/negative highvoltage is applied to the rotating electrical connector, a processwindow may be expanded by changing locations of an insulating barrierand the brushes such that DC plasma discharge does not occur andhardware stability may be secured.

A conventional slipring is used at atmospheric pressure, but cannot beused in a vacuum chamber due to occurrence of DC discharge when theinside of the vacuum chamber is in a high vacuum state.

According to an example embodiment, in order to apply a high voltage toan electrostatic chuck mounted on a rotating electrical connector, astructure of an insulating barrier of the rotating electrical connectorand a location and a structure of a brush of the rotating electricalconnector are changed to suppress parasitic discharge. Thus, when aprocess is performed in the vacuum chamber, an issue such as occurrenceof gas leakage, caused by parasitic DC discharge, may be addressed.

A rotating electrical connector according to an example embodiment mayincrease a discharge path between a pair of electrode rings to suppressparasitic discharge. In addition, by changing a structure of aninsulating barrier into a structure having a raised spot, a parasiticdischarge path may be increased to suppress parasitic discharge.

A rotating electrical connector according to an example embodiment maysuppress parasitic discharge while applying a high voltage to anelectrostatic chuck and may operate the electrostatic chuck at the highvoltage to increase substrate suction force. Thus, the rotatingelectrical connector may increase revolving and rotating speeds of theelectrostatic chuck to improve process uniformity and an etching rate.

In addition, the rotating electrical connector may suppress theparasitic discharge to control leakage occurring when a substrate ischucked. In addition, sliding of the substrate, caused by the leakage,may be addressed. In addition, occurrence of parasitic discharge or arcmay be prevented to reduce maintenance costs.

FIG. 7 is a perspective view of a rotating electrical connector forvacuum with a cover removed, according to an example embodiment of thepresent disclosure.

FIG. 8 is a cross-sectional view taken along line I-I′ in FIG. 7.

FIG. 9 is a cross-sectional view taken along line B-B′ in FIG. 7.

FIG. 10 is a perspective view of an input connector insulating block ofthe rotating electrical connector in FIG. 7.

FIG. 11 is a perspective view of a brush in FIG. 7.

Referring to FIGS. 7 to 11, a rotating electrical connector for vacuum300 includes a rotator 355 formed of an insulating material and having acylindrical shape, an upper conductive ring 351 a and a lower conductivering 351 b disposed to cover side surfaces of the rotator 355 and spacedapart from each other, and an intermediate insulating barrier 373disposed between the upper conductive ring 351 a and the lowerconductive ring 351 b. The intermediate insulating barrier 373 blocksgeneration of plasma between the upper conductive ring 351 a and thelower conductive ring 351 b.

The upper insulating barrier 371 is disposed above the upper conductivering 351 a, and the lower insulating barrier 374 is disposed below thelower conductive ring 351 b. The intermediate insulating barrier 373protrudes further in an external radius direction than the upperinsulating barrier 371 and the lower insulating barrier 374.

The upper bearing 354 a is disposed on an upper side surface of therotator 355, and the lower bearing 354 b is vertically aligned with theupper bearing 354 a and is disposed on a lower side surface of therotator 355.

A stator 363 is disposed to be in contact with the upper bearing and thelower bearing and to cover the upper insulating barrier 371, the lowerinsulating barrier 374, and the intermediate insulating barrier 373.

The rotator 355 may be rotated by the upper bearing 354 a and the lowerbearing 354 b. The rotator 355 may basically have a cylindrical shape.An electrostatic chuck or a support portion for supporting theelectrostatic chuck may be disposed in the rotator 355. The rotator 355may be formed of an insulating material, in detail, engineering plastic.A ring-shaped recessed portion may be disposed on an external sidewallof the rotator 355, and the upper insulating barrier 371, theintermediate insulating barrier 373, and the lower insulating barrier374 may be inserted into the recessed portion to be aligned with eachother and fixed to each other. As the rotator 355 rotates while mountingthe upper bearing 354 a and the lower bearing 354 b thereon, the upperconductive ring 351 a and the lower conductive ring 351 b may rotatetogether.

An upper external surface of a rotator body 355 a is provided with anupper raised portion, the upper bearing 354 a may be inserted into theupper raised portion. A lower external surface of the rotator body 355 amay have a lower raised portion and the lower bearing 354 b may beinserted into the lower raised portion. A first output connector 365 amay be connected to the upper conductive ring 351 a through a conductivewire, and a second output connector 365 b may be connected to the lowerconductive ring 351 b through a conductive wire. The first outputconnector 365 a may provide a positive high voltage to an electrostaticchuck, and the second output connector 365 b may provide a negative highvoltage to the electrostatic chuck.

Each of the upper conductive ring 351 a and the lower conductive ring351 b may be formed of a conductive material and may have a ring shape.The upper conductive ring 351 a may be applied with a positive highvoltage, and the lower conductive ring 351 b may be applied with anegative high voltage. The upper conductive ring 351 a and the lowerconductive ring 351 b may be insulated by the intermediate insulatingbarrier 373. Since the upper conductive ring 351 a and the lowerconductive ring 351 b are directly exposed to a vacuum state, parasiticdischarge may occur when the intermediate insulating barrier 373 doesnot sufficiently block an electric field. Accordingly, the intermediateinsulating barrier 373 may sufficiently extend in the external radiusdirection. As a result, parasitic discharge may be blocked by increasinga parasitic discharge path between the upper conductive ring 351 a andthe lower conductive ring 351 b in an exposed portion. The parasiticdischarge is reduced as a discharge path is increased, and is reduced asa discharge space is decreased.

An insulating barrier 370 may protrude in the external radius directionto increase an external parasitic discharge path between the upperconductive ring 351 a and the lower conductive ring 351 b. In addition,the insulating barrier 370 may be disposed to cover internal surfaces ofthe upper conductive ring 351 a and the lower conductive ring 351 b suchthat an internal parasitic discharge path between the upper conductivering 351 a and the lower conductive ring 351 b is increased, and mayprovide a serpentine parasitic discharge path.

The intermediate insulating barrier 373 may be formed of an insulatingmaterial with a sufficiently high breakdown voltage. The intermediateinsulating barrier 373 may have a circular washer shape. An externaldiameter of the intermediate insulating barrier 373 may be greater thanan external diameter of each of the upper insulating barrier 371 and thelower insulating barrier 374. An internal radius of the intermediateinsulating barrier 373 may be substantially the same as an internalradius of each of the upper insulating barrier 371 and the lowerinsulating barrier 374.

Each of the upper insulating barrier 371 and the lower insulatingbarrier 374 may have a circular washer shape. The upper insulatingbarrier 371 or the intermediate insulating barrier 373 may protrude tobe in contact with an internal side surface of the upper conductive ring351 a. The lower insulating barrier 374 or the intermediate insulatingbarrier 373 may protrude to be in contact with an internal surface ofthe lower conductive ring 351 b. Accordingly, the internal side surfaceof the upper conductive ring 351 a may be additionally insulated by theupper insulating barrier 371 or the intermediate insulating barrier 373,and the internal side surface of the lower conductive ring 351 b may beadditionally insulated by the lower insulating barrier 374 or theintermediate insulating barrier 373. As a result, the parasiticdischarge path between the upper conductive ring 351 a and the lowerconductive ring 351 b may be blocked. In addition, the parasiticdischarge path between the upper conductive ring 351 a and the lowerconductive ring 351 b may be increased to block parasitic discharge.

An internal side surface of the insulating barrier 371 may protrude in adirection of the intermediate insulating barrier 373. An internal sidesurface of the intermediate insulating barrier 373 may protrude in adirection of the lower insulating barrier 374. An internal upper surfaceof the lower insulating barrier 374 may protrude in a direction of theintermediate insulating barrier 373 to be coupled to a protrudingportion of the intermediate insulating barrier 373 with a raisedportion. An upper auxiliary insulating barrier 372 may be disposedbetween the upper insulating barrier 371 and the intermediate insulatingbarrier 373. The upper auxiliary insulating barrier 372 may be coupledto the protruding portion with the raised portion of the upperinsulating barrier 371. The upper auxiliary insulating barrier 372 maybe coupled to an internal side surface of the upper conductive ring 351a. A structure of the insulating barrier may make a discharge pathserpentine to suppress the parasitic discharge.

The stator 363 may have a cylindrical shape, and may have a cuttingsurface 363 c formed by vertically cutting a portion of a side surface363 of the stator 363. An input connector insulation block 366 mayextend in a length direction and may be disposed along the cuttingsurface 363 c. Each of a first input terminal 367 a and a second inputterminal 367 b may be spaced apart from the input connector insulatingblock 366. The first input terminal 367 a may receive a positive highvoltage, and the second input terminal 367 b may receive a negative highvoltage. The input connector insulating block 366 may protrude to aninternal space 363 c.

A protruding portion 366 a of the input connector insulating block 366may have a hole formed in a length direction therein. A lead line 369,running along the hole, may perform electrical wiring. The lead line 369may be coated with an insulating material.

A first insulating brush support portion 361 a may be disposed in atoroidal internal space 363 c of the stator 363. The first insulatingbrush support portion 361 a may have a right prismatic shape. The firstinsulating brush support portion 361 a may be fitted in the internalspace 363 c to be fixed. An upper brush 362 a may be fixed to the firstinsulating brush support portion 361 a and may be in electrical contactwith the upper conductive ring 351 a. The upper brush 362 a may beformed of an elastic conductive wire or a slip, and may have a “U”shape.

A second insulating brush support portion 361 b may be disposed in theinternal space 363 c of the stator 363 and may be disposed to face thefirst insulating brush support portion 361 a. The second insulatingbrush support portion 361 b may have the same shape as the firstinsulating brush support portion 361 a.

A lower brush 362 b may be fixed to the second insulating brush supportportion 361 b and may be in electrical contact with the lower conductivering 361 b. The lower brush 362 b may have the same shape as the upperbrush 362 a. However, the lower brush 362 b may be fixed to a lower endof the second insulating brush support portion 361 b to be in electricalcontact with the lower conductive ring 361 b. Each of the upper brush362 a and the lower brush 362 b may be formed of a conductive wirehaving elasticity or a slip and may have a “U” shape.

The lower brush 362 b may be disposed so as not to overlap the upperbrush 362 a about a central axis of the stator 363 in an azimuthaldirection. In detail, the lower brush 362 b may be disposed to face theupper brush 362 a at an angle of 180 degrees. Accordingly, the lowerbrush 362 b and the upper brush 362 a may mutually suppress parasiticdischarges.

The first insulating brush support portion 361 a and the input connectorinsulating block 366 may be disposed at a difference of 90 degrees withrespect to the central axis of the stator 363. The first output terminal365 a and the second output terminal 365 b may be disposed at adifference of 180 degrees with respect to the central axis of therotator 355. The upper brush 362 a may be connected to the first inputterminal 367 a through a wire 369, and the lower brush 362 b may beconnected to the second input terminal 367 b through a wire. In order tosuppress parasitic discharge between the upper brush 362 a and the lowerconductive ring, the intermediate insulating barrier 373 may be disposedto have a minimum tolerance with the upper brush support portion 361 a.

FIG. 12 is a perspective view of a brush support part according toanother example embodiment of the present disclosure.

FIG. 13 is a cross-sectional view illustrating a rotating electricalconnector for vacuum provided with the brush support part in FIG. 12.

Referring to FIGS. 12 and 13, a rotating electrical connector for vacuum400 includes a rotator 355 formed of an insulating material and having acylindrical shape, an upper bearing 354 a disposed on an upper sidesurface of the rotator 355, a lower bearing 354 b vertically alignedwith the upper bearing 354 a and disposed on a lower side surface of therotator 355, an upper conductive ring 351 a and a lower conductive ring351 b disposed to cover side surfaces of the rotator 355 and spacedapart from each other, a washer-shaped insulating barrier 370 disposedbetween the upper conductive ring 351 a and the lower conductive ring351 b and disposed to cover the rotator 355, a stator 363 disposed to bein contact with the upper bearing 354 a and the lower bearing 354 b andto cover the insulating barrier 370, the upper conductive ring 354 a,and the lower conductive ring 354 b, an upper brush 462 a disposed to bein electrical contact with the upper conductive ring 354 a, and a lowerbrush 462 b disposed to face the upper brush 462 a so as not to overlapthe upper brush 462 a with respect to a central axis of the stator 363in an azimuthal direction.

The upper brush 462 a and the lower brush 462 b may be spaced apart fromeach other in the azimuthal direction so as not to overlap each other.In detail, the upper brush 462 a and the lower brush 462 b may bedisposed at regular intervals of 180 degrees with respect to the centralaxis of the stator 363.

The insulating barrier 370 may be disposed to have a minimum tolerancewith the upper brush support portion 461 a to suppress parasiticdischarge between the upper brush 462 a and the lower conductive ring354 b. Each of the upper brush support portion 461 a and the lower brushsupport portion 461 b may have an arc shape to reduce a parasiticdischarge space. Each of the upper brush support portion 461 a and thelower brush support portion 461 b may have an arc shape. The upper brushsupport portion 461 a and the lower brush support portion 461 b mayinclude a lower protruding portion 461 c and an upper protruding portion461 d protruding from internal side surfaces thereof, respectively. Aportion of the lower brush 462 b may be embedded in the lower protrudingportion to be insulated. In addition, a portion of the upper brush 462 amay be embedded in the upper protruding portion to be insulated.

The insulating barrier 370 may include an upper insulating barrier 371guiding the upper brush 462 a, a lower insulating barrier 374 guidingthe lower brush 462 b, and an intermediate insulating barrier 373insulating and guiding the upper brush 462 a and the lower brush 462 b.An upper auxiliary insulating barrier 372 may be disposed between theupper insulating barrier 371 and the intermediate insulating barrier373. Components, constituting the insulating barrier 370, may provide aserpentine parasitic discharge path to suppress internal parasiticdischarge of the upper brush 462 a and the lower conductive ring 354 b.

FIG. 14 is a plan view illustrating a magnetic gear of a substrateprocessing apparatus according to an example embodiment of the presentdisclosure.

FIG. 15 is a cross-sectional view illustrating the substrate processingapparatus in FIG. 14.

FIG. 16 is an enlarged view illustrating an electrostatic chuck and arotating electrical connector in FIG. 14.

Referring to FIGS. 14 to 16, a substrate processing apparatus 1000according to an example embodiment includes a first disk 1124 having aplurality of seating holes 1124 a periodically arranged on a constantradius from a central axis thereof and disposed inside a chamber torotate, a plurality of electrostatic chucks 1170 disposed respectivelyin the seating holes 1124 a and rotating while revolving with rotationof the first disk 1124, and first rotating electrical connectors 300disposed respectively in the seating holes 1124 a to prove electricalconnection while providing a rotational motion to the electrostaticchucks 1170. The first rotating electrical connector 300 may be theabove-described rotating electrical connector for vacuum 300.

Each of the first rotating electrical connectors 300 may include arotator 355 formed of an insulating material and having a cylindricalshape, an upper conductive ring 351 a and a lower conductive ring 351 bdisposed to cover side surfaces of the rotator 355 and spaced apart fromeach other, and an insulating barrier 370 disposed between the upperconductive ring 351 a and the lower conductive ring 351 b. Theinsulating barrier 370 blocks generation of plasma between the upperconductive ring 351 a and the lower conductive ring 351 b.

Each of the first rotating electrical connectors 300 may include arotator 355 formed of an insulating material and having a cylindricalshape, an upper bearing 354 a disposed on an upper side surface of therotator 355, a lower bearing 354 b vertically aligned with the upperbearing 354 a and disposed on a lower side surface of the rotator 355,an upper conductive ring 351 a and a lower conductive ring 351 bdisposed to cover side surfaces of the rotator 355 and spaced apart fromeach other, an insulating barrier 370 disposed between the upperconductive ring 351 a and the lower conductive ring 351 b and disposedto cover the rotator 355, a stator 363 disposed to be in contact withthe upper bearing 354 a and the lower bearing 354 b and to cover theinsulating barrier 370, the upper conductive ring 351 a, and the lowerconductive ring 351 b, an upper brush 362 a dispose to be in electricalcontact with the upper conductive ring 351 a; and a lower brush 362 brotating in an azimuthal direction with respect to a central axis of thestator 363 so as not to overlap the upper brush 362 a.

The chamber 1102 may be a cylindrical chamber. The chamber 1102 mayperform a thin film deposition process or a substrate surface treatmentprocess. A gas distribution unit 1180 may be disposed on an internalupper surface of the chamber 1102. The gas distribution unit 1180 mayhave a toroidal shape having a rectangular section. A lower surface ofthe gas distribution unit 1180 may include a plurality of gas injectionholes through which a gas may be injected to the substrate 10 to performa deposition process. The electrostatic chucks 1170 may be periodicallydisposed on the lower surface of the gas distribution unit 1180 at aconstant radius.

The first disk 1124 may be a circular plate. The first disk 1124 mayrotate about a central axis thereof. The first disk 1124 may include aplurality of seating holes 1124 a disposed on a circumference having aconstant radius at regular intervals. The number of the seating holes1124 a may be six. A power distribution unit 1250 may be disposed on anupper surface of the disk 1124.

The second disk 1162 may be inserted into the seating hole 1124 a or thefirst rotating connector structure 300. The rotating plate 162 mayrevolve with the rotation of the disk 124. The second disk 1162 mayrevolve with rotation of the first disk 1124. The second disk may rotatewhile revolving through magnetic gears 1140, 1130, and 1230. Angularspeed of the rotation may be determined by a gear ratio of the magneticgear. The second disk 1162 may have a circular plate shape, and may beformed of a material such as a metal, graphite, quartz, or the like. Thesecond disk 1162 may support the electrostatic chuck 1170 and may becoupled to the first magnetic gear 1140.

The first rotating connector 300 may be disposed to cover the seconddisk 162 and may be inserted into the seating hole 1124 a. Each of theupper bearing 354 a and the lower bearing 354 b may have a toroidalshape. The rotator 355 may be disposed between the upper bearing 354 aand the lower bearing 354 b, and may be rotatable and be electricallyinsulated or be formed of an insulating material.

The electrostatic chuck 1170 may be disposed on an upper surface of thesecond disk 1162. The electrostatic chuck 1170 may receive power from alead line extending through a lead line path formed in the second disk1162. The electrostatic chuck 1170 may have a lead line path and a leadline, passing through the lead line path, may perform electricalconnection with an electrostatic electrode. The electrostatic chuck 1170may include an insulating member 1174 and a pair of electrostaticelectrodes 1172 embedded in the insulating member 1174. Theelectrostatic chuck 1170 may operate as a bipolar electrostatic chuck. Alower surface of the electrostatic chuck 1170 may be higher than anupper surface of the first disk 1124. The insulating member 1174 may bedisposed to cover the pair of electrostatic electrodes 1172. A thicknessof the lower insulating member, disposed on a lower surface of theelectrostatic electrode 1172, may be higher than a thickness of theupper insulating member disposed on an upper surface of theelectrostatic electrode 1172. The lower insulating member may be formedon an electrostatic chuck body through thermal spray coating and may becoated by printing the electrostatic electrode 1172. After theelectrostatic electrode is patterned, the upper insulating member may beformed through thermal spray coating. The insulating member 1174 maysupply Coulomb-type electrostatic force or Johnsen-Rahbek typeelectrostatic force depending on resistivity. Each of the pair ofelectrostatic electrodes 1172 may have a washer shape of concentricstructure. A second electrostatic electrode may cover the firstelectrostatic electrode with the concentric structure, and the pair ofelectrostatic electrodes 172 may be disposed on the same plane.

The electrostatic electrode 1172 may include a first electrostaticelectrode and a second electrostatic electrode having a concentricstructure, and a high DC voltage may be applied between the firstelectrostatic electrode and the second electrostatic electrode.Accordingly, the substrate disposed on the electrostatic chuck 1172 maybe fixed by electrostatic suction force.

A first disk central shaft 1122 may extend from a central axis of thefirst disk 1124 in a direction of a lower surface of the chamber 1102. Asecond disk central shaft 1122 may have a cylindrical shape and may havea lead line path in which a lead line may be disposed. A portion of thepower distribution unit 1250 may be disposed on the lead line path. Thefirst disk central axis 1122 may be fixedly coupled to the first disk1124.

A second rotating electrical connector 1112 may be axially coupled toone end of the first disk central shaft 1122 penetrating through abellows structure 1116 and may provide electrical connection whileproviding a rotational motion. The second rotating electrical connector1112 may perform substantially the same function as the first rotatingelectrical connector 300. The second rotating connector structure 1112may be a slipring. A brush may be connected to the power supply 1114,and may supply power to a lead line disposed on a lead line pathextending along the first disk central shaft 1122 rotating through thesecond rotating electrical connector 1112. The power may be supplied tothe electrostatic chuck 1170 to the electrostatic chuck 1170 through therotating electrical connector 300. The external DC power supply 1114 mayoutput a positive DC voltage and a negative DC voltage.

A rotation driving unit 1110 may be coupled to one end of the first diskcentral shaft 1112 to rotate the first disk central shaft 1122. Therotation driving unit 1110 may be a motor. According to elasticity ofthe bellows structure 1116, the rotation driving unit 1110, the rotatingelectrical connector 1112, the first disk central shaft 1122, and thefirst disk 1124 may vertically move.

First magnetic gears 1140 may be respectively fixed to lower surfaces ofthe second disks 1162 to provide rotational force to the second disk1162 and the electrostatic chuck 1170. The second magnetic gear 1130 maybe disposed below the first disk 1124 to be fixed to the chamber 1102.Third magnetic gears 1230 may be rotatably fixed to the lower surface ofthe first disk 1124 and may be respectively disposed between the firstmagnetic gears 1140 and the second magnetic gear 1130 to adjust arotation ratio. As the first disk 1124 revolves, the first magneticgears 1140 and the third magnetic gears 1230 may rotate.

Each of the electrostatic chuck 1170 and the second disk 1162 may haveat least three vertical through-holes. The vertical through-holes may bevertically aligned with each other in the electrostatic chuck 1170 andthe second disk 1162. When the first disk 1124 and the second disk 1162are stopped, a lift pin 1194 lifting the substrate may be insertedthrough the vertical through-hole. The lift pin 194 may be verticallyand linearly moved by a lift pin driving unit 192.

The power distribution unit 1250 may include power pillars 1251 a and1251 b, disposed to penetrate through the first disk central shaft 1122,and a plug extending from an upper surface and a lower surface of thefirst disk 1124 and penetrating through the first disk 1124. The powerdistribution unit 1250 may extend along an inside, an upper surface,and/or a lower surface of the first disk 1124 and may distribute a highvoltage to electrostatic chucks. An upper cover 1259 may be disposed onthe first disk 1124 and may be disposed to cover a portion of the powerdistribution unit 1250.

As described above, according to an example embodiment, a powerdistribution unit provides a symmetrical structure and the same wiringlength to provide substantially the same electrical characteristics toall electrostatic chucks. Thus, suction forces of all of theelectrostatic chucks may be the same.

According to an example embodiment, the power distribution unit mayprovide ease of decoupling/coupling by arranging a wiring on an uppersurface of a first disk.

According to an example embodiment, in order to adjust a rotation periodof a rotating first magnetic gear, a third magnetic gear may be disposedbetween a fixed second magnetic gear and the first magnetic gear toprovide an appropriate rotation period of the first magnetic gear.

A rotating electrical connector according to an example embodiment mayincrease a height of an intermediate insulating barrier, disposedbetween a pair of electrode rings, such that a parasitic discharge pathis increased to suppress parasitic discharge.

In the rotating electrical connector according to an example embodiment,a first brush charged with a positive high voltage and a second brushcharged with a negative high voltage may be sufficiently spaced apartfrom each other to suppress parasitic discharge between the first brushand the second brush.

According to an example embodiment, a substrate processing apparatusincluding the rotating electrical connector may stably apply a highvoltage to an electrostatic chuck, rotating and revolving at the sametime, without parasitic discharge to provide sufficient substrateadsorption force.

Although the present disclosure and its advantages have been describedin detail, it should be understood that various changes, substitutionsand alterations can be made herein without departing from the spirit andscope of the disclosure as defined by the following claims.

What is claimed is:
 1. A substrate processing apparatus comprising: adisk comprising a plurality of electrostatic chucks periodicallydisposed at a constant radius from a central axis; a disk supportsupporting the disk; a DC line electrically connected to the pluralityof electrostatic chucks through the disk support; and a power supplyconfigured to supply power to the DC line, wherein the DC linecomprises: a first DC line penetrating through the disk support from thepower supply; a power distribution unit configured to distribute thefirst DC line to connect the first DC line to each of the plurality ofelectrostatic chucks; and a plurality of second DC lines respectivelyconnected to the plurality of electrostatic chucks in the powerdistribution unit.
 2. The substrate processing apparatus as set forth inclaim 1, wherein the power distribution unit comprises: an internalpower distribution ring having a plurality of first connection terminalsprotruding in an external radial direction and charged with a positivevoltage and disposed on an upper surface of the disk; and an externalpower distribution ring having a second connection terminal protrudingin an internal radial direction and charged with a negative voltage anddisposed on an upper surface of the disk.
 3. The substrate processingapparatus as set forth in claim 2, wherein the internal powerdistribution ring has a snap ring shape in which a portion of a radiusis cut, the external power distribution ring has a snap ring shape inwhich a portion of a radius is cut, the cut portion of the internalpower distribution ring and the external power distribution ring aredisposed to oppose each other, the first DC line comprises a firstpositive DC line and a first negative DC line, the internal powerdistribution ring comprises a first connection portion connecting oneend of the first positive DC line and an opposite side of the cutportion of the internal power distribution ring, and the external powerdistribution ring comprises a second connection portion connecting oneend of the first negative DC line and an opposite side of the cutportion of the external power distribution ring.
 4. The substrateprocessing apparatus as set forth in claim 3, wherein the powerdistribution unit further comprises: a first contact plug connected tothe first connection terminal and extending through the disk; and asecond contact plug connected to the second connection terminal andextending through the disk, wherein the second DC line comprises asecond positive DC line and a second negative DC line, one end of thesecond positive DC line is connected to the first contact plug, thesecond positive DC line extends from a lower surface of the disk, oneend of the second negative DC line is connected to the second contactplug, and the second negative DC line extends from the lower surface ofthe disk.
 5. The substrate processing apparatus as set forth in claim 4,wherein the second positive DC line and the second negative DC line areconnected to the first rotating connector structure, and the firstcontact plug and the second contact plug are disposed to form a pair ona constant radius.
 6. The substrate processing apparatus as set forth inclaim 1, wherein the power distribution unit is coated with aninsulating material.
 7. The substrate processing apparatus as set forthin claim 2, wherein the power distribution unit further comprises anupper cover disposed on the disk and disposed to cover the internalpower distributing ring and the external power distribution ring, andthe upper cover has a disk shape and is semicircularly recessed in alocation in which the electrostatic chucks are disposed.
 8. Thesubstrate processing apparatus as set forth in claim 4, wherein each ofthe second positive DC line and the second negative DC line is bent tohave a “V” shape.
 9. The substrate processing apparatus as set forth inclaim 1, further comprising: a rotating plate inserted into a firstrotating connector structure, rotating an electrostatic chuck, andsupporting and rotating the electrostatic chuck; first magnetic gears,respectively fixed to lower surfaces of the rotating plates to providerotational force to the rotating plate and the electrostatic chuck; asecond magnetic gear disposed below the disk to be fixed to the chamber;and third magnetic gears rotatably fixed to the disk and respectivelydisposed between the first magnetic gears and the second magnetic gearto adjust a rotation ratio, wherein the first magnetic gears and thethird magnetic gears rotate as the disk revolves.
 10. The substrateprocessing apparatus of claim 1, wherein the electrostatic chuckcomprises: an electrostatic chuck body; an electrode seating portionrecessed in an upper surface of the electrostatic chuck body; aninsulating member filling the electrode seating portion; and a pair ofelectrostatic electrodes embedded in the insulating member, and whereinthe first rotating connector structure applies a high DC voltage to thepair of electrostatic electrodes.